CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Package Frequency Type Series Datasheet Mfr Base Product Number Operating Temperature Mounting Type Voltage - Supply Package / Case Supplier Device Package Data Rate (Max) Product Status Utilized IC / Part Memory Size Sensitivity Current - Receiving Protocol RF Family/Standard Modulation Data Rate Power - Output Serial Interfaces Antenna Type Current - Transmitting GPIO
HDG204-DN-3 HDG204-DN-3 H&D Wireless AB 40.4700
RFQ

Min: 1

Mult: 1

0.00000000 Tray 2.4GHz ~ 2.5GHz TxRx Only - download H&D Wireless AB HDG204 -40°C ~ 85°C Surface Mount 3.3V 44-TQFN Exposed Pad Module 44-QFN SIP (8x8) 54Mbps Active - -96dBm 60mA 802.11b/g WiFi 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM 18dBm SPI 15mA 2
HDG205-DN-3 HDG205-DN-3 H&D Wireless AB 35.3300
RFQ

Min: 1

Mult: 1

0.00000000 Tray 2.4GHz TxRx + MCU - download H&D Wireless AB HDG205 -20°C ~ 85°C Surface Mount 2.85V ~ 4.35V Module - 65Mbps Active - -94dBm 53mA 802.11b/g/n WiFi 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK 17dBm SPI, UART 205mA 6
HDG820P-BCQ3 HDG820P-BCQ3 H&D Wireless AB 35.3300
RFQ

Min: 1

Mult: 1

0.00000000 Tray 2.4GHz - download H&D Wireless AB HDG820 -40°C ~ 85°C Surface Mount 3V ~ 3.6V Module Active - - - - 802.11b/g/n WiFi - 72.2Mbps - SPI, UART - -
SPB800-BCP1 SPB800-BCP1 H&D Wireless AB 27.7500
RFQ

Min: 1

Mult: 1

0.00000000 Tray 2.4GHz - download H&D Wireless AB SPB800 -40°C ~ 85°C Surface Mount 3V ~ 3.6V Module Active - - - 77mA 802.11b/g WiFi 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM 54Mbps - UART Integrated, Chip 186mA
HDG104-DN-2 HDG104-DN-2 H&D Wireless AB 18.4700
RFQ

Min: 1

Mult: 1

0.00000000 Tape & Reel (TR) 2.4GHz TxRx + MCU - download H&D Wireless AB HDG104 -20°C ~ 70°C Surface Mount 2.75V ~ 3.6V 44-LQFN Exposed Pad Module 44-QFN SIP (7.7x7.1) 54Mbps Active 1kB EEPROM, 160kB SRAM -96dBm 60mA 802.11b/g WiFi 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK 17dBm SDIO, SPI, UART 15mA
HDG200-DN-3 HDG200-DN-3 H&D Wireless AB 35.3300
RFQ

Min: 1

Mult: 1

0.00000000 Tray 2.4GHz TxRx + MCU - download H&D Wireless AB HDG200 -40°C ~ 85°C Surface Mount 2.75V ~ 3.6V 44-TQFN Exposed Pad Module 44-QFN SIP (8x8) 72.2Mbps Active 1kB EEPROM, 160kB SRAM - 49mA 802.11b/g/n WiFi - 17dBm SDIO, SPI 197mA

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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