CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

HDG200-DN-3

Manufacturer No:

3405

Manufacturer:

H&D Wireless AB

Quantity:

9999

Model:

default

Datasheet:

HDG200-DN-3

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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HDG200-DN-3

IC RF TXRX+MCU WIFI 44TQFN

  • Type
    Parameter
    Select All
  • Mfr

    H&D Wireless AB

  • Series

    -

  • Package

    Tray

  • Product Status

    Active

  • Type

    TxRx + MCU

  • RF Family/Standard

    WiFi

  • Protocol

    802.11b/g/n

  • Modulation

    -

  • Frequency

    2.4GHz

  • Data Rate (Max)

    72.2Mbps

  • Power - Output

    17dBm

  • Sensitivity

    -

  • Memory Size

    1kB EEPROM, 160kB SRAM

  • Serial Interfaces

    SDIO, SPI

  • Voltage - Supply

    2.75V ~ 3.6V

  • Current - Receiving

    49mA

  • Current - Transmitting

    197mA

  • Operating Temperature

    -40°C ~ 85°C

  • Mounting Type

    Surface Mount

  • Package / Case

    44-TQFN Exposed Pad Module

  • Supplier Device Package

    44-QFN SIP (8x8)

  • Base Product Number

    HDG200

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