CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

YFF32SC1E472M

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

Datasheet:

YFF32SC1E472M

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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YFF32SC1E472M

CAP FEEDTHRU 4700PF 25V 1206

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    YFF-SC

  • Package

    Tape & Reel (TR)

  • Product Status

    Obsolete

  • Capacitance

    4700 pF

  • Tolerance

    -

  • Voltage - Rated

    25V

  • Current

    200 mA

  • DC Resistance (DCR) (Max)

    600mOhm

  • Operating Temperature

    -55°C ~ 125°C

  • Insertion Loss

    -

  • Temperature Coefficient

    -

  • Ratings

    -

  • Mounting Type

    Surface Mount

  • Package / Case

    1206 (3216 Metric), 4 PC Pad

  • Size / Dimension

    0.126" L x 0.049" W (3.20mm x 1.25mm)

  • Height (Max)

    0.039" (1.00mm)

  • Thread Size

    -

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