CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

XMC0812F1-20G

Manufacturer No:

1197

Manufacturer:

TTM Technologies, Inc.

Quantity:

9999

Model:

default

Datasheet:

XMC0812F1-20G

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XMC0812F1-20G

RF DIR COUPLER 8GHZ-12GHZ SMD

  • Type
    Parameter
    Select All
  • Mfr

    TTM Technologies, Inc.

  • Series

    Xinger III®

  • Package

    Tape & Reel (TR)

  • Product Status

    Obsolete

  • Coupler Type

    Standard

  • Frequency

    8GHz ~ 12GHz

  • Coupling Factor

    20 ± 1dB

  • Applications

    X-Band Radar

  • Insertion Loss

    0.5dB

  • Power - Max

    25W

  • Isolation

    -

  • Return Loss

    -

  • Package / Case

    4-SMD, No Lead

  • Supplier Device Package

    -

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  • Description:

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