CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

XFBMC29-DIP027-B

Manufacturer No:

1369

Manufacturer:

XFMRS

Quantity:

9999

Model:

default

Datasheet:

XFBMC29-DIP027-B

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XFBMC29-DIP027-B

XFMR BATT MGMT AEC-Q200

  • Type
    Parameter
    Select All
  • Mfr

    XFMRS

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Transformer Type

    Battery Management

  • Turns Ratio - Primary:Secondary

    1CT:1CT

  • Mounting Type

    Surface Mount

  • Size / Dimension

    0.670" L x 0.492" W (17.02mm x 12.50mm)

  • Height - Seated (Max)

    0.425" (10.80mm)

  • Operating Temperature

    -40°C ~ 125°C

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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