CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

XCZU2EG-L2SFVC784E

Manufacturer No:

1110

Manufacturer:

AMD Xilinx

Quantity:

9999

Model:

default

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XCZU2EG-L2SFVC784E

IC SOC CORTEX-A53 784FCBGA

  • Type
    Parameter
    Select All
  • Supplier Device Package

    784-FCBGA (23x23)

  • Number of I/O

    252

  • Mfr

    AMD Xilinx

  • Series

    Zynq® UltraScale+™ MPSoC EG

  • Package

    Tray

  • Product Status

    Active

  • Architecture

    MCU, FPGA

  • Core Processor

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size

    -

  • RAM Size

    256KB

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

  • Operating Temperature

    0°C ~ 100°C (TJ)

  • Package / Case

    784-BFBGA, FCBGA

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Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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  • Manufacturer No:

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