CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

W631GU6NB09I TR

Manufacturer No:

466

Manufacturer:

Winbond Electronics

Quantity:

9999

Model:

default

Datasheet:

W631GU6NB09I TR

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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W631GU6NB09I TR

1GB DDR3L 1.35V SDRAM, X16, INDU

  • Type
    Parameter
    Select All
  • Mfr

    Winbond Electronics

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Memory Type

    Volatile

  • Memory Format

    DRAM

  • Technology

    SDRAM - DDR3L

  • Memory Size

    1Gbit

  • Memory Organization

    64M x 16

  • Memory Interface

    Parallel

  • Clock Frequency

    1.066 GHz

  • Write Cycle Time - Word, Page

    15ns

  • Access Time

    20 ns

  • Voltage - Supply

    1.283V ~ 1.45V, 1.425V ~ 1.575V

  • Operating Temperature

    -40°C ~ 95°C (TC)

  • Mounting Type

    Surface Mount

  • Package / Case

    96-VFBGA

  • Supplier Device Package

    96-VFBGA (7.5x13)

  • Base Product Number

    W631GU6

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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