CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

TW-02-03-T-S-386-075

Manufacturer No:

323

Manufacturer:

Samtec Inc.

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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TW-02-03-T-S-386-075

CONN BRD STACK 2.00 2POS

  • Type
    Parameter
    Select All
  • Mfr

    Samtec Inc.

  • Series

    TW

  • Package

    Bulk

  • Product Status

    Active

  • Number of Positions

    2

  • Pitch

    0.079" (2.00mm)

  • Number of Rows

    1

  • Row Spacing

    -

  • Length - Overall Pin

    0.535" (13.589mm)

  • Length - Post (Mating)

    0.074" (1.880mm)

  • Length - Stack Height

    0.386" (9.800mm)

  • Length - Tail

    0.075" (1.905mm)

  • Mounting Type

    Through Hole

  • Termination

    Solder

  • Contact Finish - Post (Mating)

    Tin

  • Contact Finish Thickness - Post (Mating)

    -

  • Color

    Black

  • Base Product Number

    TW-02-03

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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  • Manufacturer No:

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  • Manufacturer No:

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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