CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

TISP7082F3SL

Manufacturer No:

223

Manufacturer:

Bourns Inc.

Quantity:

9999

Model:

default

Datasheet:

TISP7082F3SL

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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TISP7082F3SL

THYRISTOR 66V 80A RADIAL 3LEAD

  • Type
    Parameter
    Select All
  • Mfr

    Bourns Inc.

  • Series

    -

  • Package

    Tube

  • Product Status

    Obsolete

  • Voltage - Breakover

    82V

  • Voltage - Off State

    66V

  • Voltage - On State

    5 V

  • Current - Peak Pulse (8/20µs)

    80 A

  • Current - Peak Pulse (10/1000µs)

    40 A

  • Current - Hold (Ih)

    150 mA

  • Number of Elements

    3

  • Capacitance

    66pF

  • Mounting Type

    Through Hole

  • Package / Case

    Radial - 3 Leads

  • Base Product Number

    TISP70

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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