CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

TISP3260F3P

Manufacturer No:

223

Manufacturer:

Bourns Inc.

Quantity:

9999

Model:

default

Datasheet:

TISP3260F3P

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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TISP3260F3P

THYRISTOR 200V 120A 8DIP

  • Type
    Parameter
    Select All
  • Mfr

    Bourns Inc.

  • Series

    -

  • Package

    Tube

  • Product Status

    Obsolete

  • Voltage - Breakover

    260V

  • Voltage - Off State

    200V

  • Voltage - On State

    3 V

  • Current - Peak Pulse (8/20µs)

    120 A

  • Current - Peak Pulse (10/1000µs)

    35 A

  • Current - Hold (Ih)

    150 mA

  • Number of Elements

    2

  • Capacitance

    45pF

  • Mounting Type

    Through Hole

  • Package / Case

    8-DIP (0.300", 7.62mm)

  • Base Product Number

    TISP3260

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