CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

SPHWHAHDNA25WJW3DB

Manufacturer No:

2812

Quantity:

9999

Model:

default

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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SPHWHAHDNA25WJW3DB

LED COB 3 STEP

  • Type
    Parameter
    Select All
  • Mfr

    Samsung Semiconductor, Inc.

  • Series

    COB D Gen2

  • Package

    Box

  • Product Status

    Active

  • Type

    Chip On Board (COB)

  • Color

    White, Warm

  • CCT (K)

    2700K 3-Step MacAdam Ellipse

  • Wavelength

    -

  • Configuration

    Square

  • Luminous Flux @ Current/Temperature

    468lm (Typ)

  • Current - Test

    180mA

  • Temperature - Test

    85°C

  • Voltage - Forward (Vf) (Typ)

    17V

  • Lumens/Watt @ Current - Test

    153 lm/W

  • Current - Max

    360mA

  • CRI (Color Rendering Index)

    80

  • Viewing Angle

    115°

  • Features

    -

  • Size / Dimension

    13.50mm L x 13.50mm W

  • Height

    1.50mm

  • Light Emitting Surface (LES)

    9.80mm Dia

  • Lens Type

    Flat

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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