CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

NSN0.38SS500

Manufacturer No:

607

Manufacturer:

Techflex

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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NSN0.38SS500

EXPAND SLEEV 3/8"X500' BLK/YLW

  • Type
    Parameter
    Select All
  • Mfr

    Techflex

  • Series

    Non-Skid™

  • Package

    Spool

  • Product Status

    Active

  • Type

    Sleeve

  • Type Attributes

    Expandable

  • Diameter - Inside, Non-Expanded

    0.375" (9.53mm)

  • Diameter - Inside, Expanded

    0.500" (12.70mm)

  • Diameter - Outside, Non-Expanded

    -

  • Material

    Polyethylene Terephthalate (PET), Halogen Free

  • Color

    Black, Yellow

  • Length

    500' (152.40m)

  • Wall Thickness

    0.070" (1.78mm)

  • Operating Temperature

    -40°C ~ 79°C

  • Heat Protection

    -

  • Abrasion Protection

    Abrasion and Cut Resistant, Wear Resistant

  • Liquid Protection

    -

  • Environment Protection

    -

  • Features

    Clean Cut, Safety Stripe, Slip Resistant

  • Material Flammability Rating

    -

  • Width

    -

  • Base Product Number

    NSN0

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