CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MEC6-140-02-S-D-RA1

Manufacturer No:

323

Manufacturer:

Samtec Inc.

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MEC6-140-02-S-D-RA1

CONN EDGE DUAL FMALE 80POS 0.025

  • Type
    Parameter
    Select All
  • Mfr

    Samtec Inc.

  • Series

    MEC6 - RA

  • Package

    Tray

  • Product Status

    Active

  • Card Type

    Non Specified - Dual Edge

  • Gender

    Female

  • Number of Positions/Bay/Row

    40

  • Number of Positions

    80

  • Card Thickness

    0.062" (1.57mm)

  • Number of Rows

    2

  • Pitch

    0.025" (0.64mm)

  • Read Out

    Dual

  • Features

    Board Guide

  • Mounting Type

    Surface Mount, Right Angle

  • Termination

    Solder

  • Contact Material

    Phosphor Bronze

  • Contact Finish

    Gold

  • Contact Finish Thickness

    10.0µin (0.25µm)

  • Contact Type

    -

  • Color

    Black

  • Flange Feature

    -

  • Operating Temperature

    -55°C ~ 125°C

  • Material - Insulation

    Liquid Crystal Polymer (LCP)

  • Base Product Number

    MEC6-140

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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