CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MEC1-130-02-F-D-A-K-TR

Manufacturer No:

323

Manufacturer:

Samtec Inc.

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MEC1-130-02-F-D-A-K-TR

CONN EDGE DUAL FMALE 60POS 0.039

  • Type
    Parameter
    Select All
  • Mfr

    Samtec Inc.

  • Series

    MEC1

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Card Type

    Non Specified - Dual Edge

  • Gender

    Female

  • Number of Positions/Bay/Row

    -

  • Number of Positions

    60

  • Card Thickness

    0.062" (1.57mm)

  • Number of Rows

    2

  • Pitch

    0.039" (1.00mm)

  • Read Out

    Dual

  • Features

    Board Guide, Pick and Place

  • Mounting Type

    Surface Mount

  • Termination

    Solder

  • Contact Material

    Beryllium Copper

  • Contact Finish

    Gold

  • Contact Finish Thickness

    3.00µin (0.076µm)

  • Contact Type

    Loop Bellows

  • Color

    Black

  • Flange Feature

    -

  • Operating Temperature

    -55°C ~ 125°C

  • Material - Insulation

    Liquid Crystal Polymer (LCP)

  • Base Product Number

    MEC1-130

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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  • Description:

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