CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MDB10S

Manufacturer No:

63

Manufacturer:

onsemi

Quantity:

9999

Model:

default

Datasheet:

MDB10S

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MDB10S

BRIDGE RECT 1PH 1KV 1A 4MICRODIP

  • Type
    Parameter
    Select All
  • Mfr

    onsemi

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Diode Type

    Single Phase

  • Technology

    Standard

  • Voltage - Peak Reverse (Max)

    1 kV

  • Current - Average Rectified (Io)

    1 A

  • Voltage - Forward (Vf) (Max) @ If

    1.1 V @ 1 A

  • Current - Reverse Leakage @ Vr

    10 µA @ 1000 V

  • Operating Temperature

    -55°C ~ 150°C (TJ)

  • Mounting Type

    Surface Mount

  • Package / Case

    4-SMD, Gull Wing

  • Supplier Device Package

    4-MicroDIP/SMD

  • Base Product Number

    MDB10

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