CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

L177SDCG37SOL2RM5

Manufacturer No:

260

Quantity:

9999

Model:

default

Datasheet:

L177SDCG37SOL2RM5

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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L177SDCG37SOL2RM5

CONN D-SUB RCPT 37POS VERT SLDR

  • Type
    Parameter
    Select All
  • Mfr

    Amphenol ICC (Commercial Products)

  • Series

    SD

  • Package

    Tray

  • Product Status

    Active

  • Connector Style

    D-Sub

  • Connector Type

    Receptacle, Female Sockets

  • Number of Positions

    37

  • Number of Rows

    2

  • Mounting Type

    Through Hole

  • Shell Size, Connector Layout

    4 (DC, C)

  • Contact Type

    Signal

  • Flange Feature

    Board Side (M3)

  • Termination

    Solder

  • Shell Material, Finish

    Steel, Tin Plated

  • Contact Finish

    Gold

  • Contact Finish Thickness

    15.0µin (0.38µm)

  • Ingress Protection

    -

  • Material Flammability Rating

    UL94 V-0

  • Current Rating (Amps)

    5A

  • Backset Spacing

    -

  • Features

    Board Lock

  • Voltage Rating

    250V

  • Color

    Black

  • Contact Form

    Stamped

  • Dielectric Material

    Thermoplastic, Glass Filled

  • Wire Gauge

    -

  • Contact Material

    Phosphor Bronze

  • Operating Temperature

    -55°C ~ 125°C

  • Base Product Number

    L177SDCG37

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

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  • Manufacturer No:

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  • Description:

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