CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

JA3D-C1001163

Manufacturer No:

18

Manufacturer:

Jabil Inc.

Quantity:

9999

Model:

default

Datasheet:

JA3D-C1001163

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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JA3D-C1001163

PA 4035 CF FIL, 1.75 MM, 1KG

  • Type
    Parameter
    Select All
  • Mfr

    Jabil Inc.

  • Series

    -

  • Package

    Spool

  • Product Status

    Active

  • Filament Material

    PA (Polyamide)

  • Color

    Black

  • Filament Diameter

    0.070" (1.75mm)

  • Tensile Strength

    66Mpa

  • Flex Strength

    110Mpa

  • Density

    -

  • Operating Temperature

    240°C ~ 260°C

  • Features

    ESD Safe, Reinforced

  • Base Product Number

    JA3D

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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