CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

FPAFF-07B.50

Manufacturer No:

1163

Manufacturer:

Fraenkische USA, LP

Quantity:

9999

Model:

default

Datasheet:

FPAFF-07B.50

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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FPAFF-07B.50

FIPLOCK, PA6 MOD V0, NW07, FINE,

  • Type
    Parameter
    Select All
  • Diameter - Inside

    0.244" (6.20mm)

  • Diameter - Outside

    0.394" (10.00mm)

  • Material

    Polyamide (PA6), Nylon 6

  • Color

    Black

  • Length

    164' (50.00m)

  • Wall Thickness

    -

  • Operating Temperature

    -45°C ~ 120°C

  • Heat Protection

    Flame Retardant

  • Abrasion Protection

    -

  • Liquid Protection

    -

  • Environment Protection

    Weather Resistant

  • Features

    Chemical Resistant

  • Material Flammability Rating

    UL94 V-0

  • Base Product Number

    FPAFF

  • Mfr

    Fraenkische USA, LP

  • Series

    Fiplock®

  • Package

    Bulk

  • Product Status

    Active

  • Type

    Wire Loom, Protective Hose

  • Type Attributes

    Convoluted, Corrugated

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