CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

FDMM064GPE-N200

Manufacturer No:

253

Manufacturer:

Flexxon Pte Ltd

Quantity:

9999

Model:

default

Datasheet:

FDMM064GPE-N200

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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FDMM064GPE-N200

FXPREM II MICROSD 64GB PSLC DIAM

  • Type
    Parameter
    Select All
  • Mfr

    Flexxon Pte Ltd

  • Series

    FxPrem II

  • Package

    Tray

  • Product Status

    Active

  • Memory Type

    microSD™

  • Memory Size

    64GB

  • Speed

    -

  • Technology

    pSLC

  • Operating Temperature

    -40°C ~ 85°C

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