CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

EF-DI-25G-TSN-802-1-CM-PROJ

Manufacturer No:

1110

Manufacturer:

AMD Xilinx

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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EF-DI-25G-TSN-802-1-CM-PROJ

10G/25G TSN 802.1CM WIRELESS PRO

  • Type
    Parameter
    Select All
  • Mfr

    AMD Xilinx

  • Series

    LogiCORE™

  • Package

    Electronic Delivery

  • Product Status

    Active

  • Type

    License

  • Applications

    -

  • Edition

    -

  • License Length

    1 Year

  • License - User Details

    Project

  • Operating System

    -

  • For Use With/Related Products

    Xilinx

  • Media Delivery Type

    -

  • Platform

    -

  • Base Product Number

    EF-DI

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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