CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BS25BL07X30RP

Manufacturer No:

1137

Manufacturer:

Bumper Specialties Inc.

Quantity:

9999

Model:

default

Datasheet:

BS25BL07X30RP

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BS25BL07X30RP

BUMPER HEMI .25" DIA X .08" BLK

  • Type
    Parameter
    Select All
  • Mounting Type

    Adhesive, Rubber

  • Mfr

    Bumper Specialties Inc.

  • Series

    -

  • Package

    Box

  • Product Status

    Active

  • Type

    Bumper

  • Shape

    Cylindrical, Dome

  • Color

    Black

  • Size / Dimension

    0.250" Dia (6.35mm)

  • Thickness

    0.079" (2.01mm)

  • Material

    Polyurethane

  • Hardness

    60-70 Shore A

  • Form

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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