CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BFS-U3-13Y3C-C

Manufacturer No:

2866

Quantity:

9999

Model:

default

Datasheet:

BFS-U3-13Y3C-C

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BFS-U3-13Y3C-C

1.3MP COLOR U3 1/2" C-MOUNT

  • Type
    Parameter
    Select All
  • Resolution

    1280 x 1024

  • Frames per Second

    170

  • Shutter

    Global

  • Lens Mount

    C

  • Sensor

    P1300

  • Type

    CMOS

  • Interface

    GigE PoE

  • Pixel Size

    4.8µm x 4.8µm

  • Mounting Type

    Chassis Mount

  • Package / Case

    Module

  • Supplier Device Package

    Module

  • Size / Dimension

    1.142" L x 1.181" W (29.00mm x 30.00mm)

  • Height (Max)

    1.142" (29.00mm)

  • Mfr

    FLIR Integrated Imaging Solutions, Inc.

  • Series

    BLACKFLY®

  • Package

    Box

  • Product Status

    Active

  • Color

    RGB

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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