CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

AE-3C-WNGZ-005619-0202-X010

Manufacturer No:

1672

Manufacturer:

Aeris

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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AE-3C-WNGZ-005619-0202-X010

GSM/2G/3G SIM+PLT MICRO 3FF 10PK

  • Type
    Parameter
    Select All
  • Mfr

    Aeris

  • Series

    NEO

  • Package

    Bulk

  • Product Status

    Discontinued at Digi-Key

  • Format

    3FF (Micro)

  • Class

    -

  • Memory

    -

  • Core Processor

    -

  • Carrier Network

    -

  • Network Technology

    2G, 3G

  • Features

    -

  • Operating Temperature

    -

  • Size / Dimension

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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