CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

A850496911N

Manufacturer No:

3250

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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A850496911N

CONN BACKSHELL ADPT SZ11 B SILV

  • Type
    Parameter
    Select All
  • Mfr

    Amphenol Interconnect India

  • Series

    Military, SAE AS85049

  • Package

    Bag

  • Product Status

    Active

  • Type

    Backshell, Heat Shrink Adapter

  • Cable Opening

    0.380" (9.65mm)

  • Diameter - Outside

    0.850" (21.59mm)

  • Shell Size - Insert

    11, B

  • Thread Size

    -

  • Cable Exit

    180°

  • Primary Material

    Metal

  • Material

    Aluminum Alloy

  • Plating

    Electroless Nickel

  • Shielding

    Unshielded

  • Color

    Silver

  • Features

    -

  • Ingress Protection

    -

  • Includes

    -

  • Material Flammability Rating

    -

  • For Use With/Related Products

    MIL-DTL-38999 Series III, IV

  • Base Product Number

    M85049

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