CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

58460-502

Manufacturer No:

115

Quantity:

9999

Model:

default

Datasheet:

58460-502

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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58460-502

CP10-127-05-L2-W4.5

  • Type
    Parameter
    Select All
  • Mfr

    Laird Thermal Systems, Inc.

  • Series

    CP

  • Package

    Bulk

  • Product Status

    Active

  • Size / Dimension

    Square - 29.70mm L x 29.70mm W

  • Qmax @ Th

    34.3W @ 25°C

  • Delta Tmax @ Th

    67°C @ 25°C

  • Height

    3.20mm

  • Number of Stages

    1

  • Current - Max

    3.9 A

  • Voltage - Max

    14.4 V

  • Resistance

    3.36 Ohms

  • Operating Temperature

    80°C

  • Features

    Lead Wires, Lapped

  • Base Product Number

    58460

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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    PIC1 8F24J11T-/SS

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