CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

50014

Manufacturer No:

1537

Quantity:

9999

Model:

default

Datasheet:

50014

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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50014

BLOW MOLDED CONDUCTIVE CASE 8 15

  • Type
    Parameter
    Select All
  • Mfr

    Conductive Containers, Inc.

  • Series

    -

  • Package

    Bulk

  • Product Status

    Active

  • Type

    Box

  • Usage

    Storage, Shipping

  • Dimensions - Overall

    8.94" L x 6.63" W x 1.25" H (227.0mm x 168.3mm x 31.8mm)

  • Material

    Plastic

  • Features

    Conductive, Foam Insert, Hinged Lid

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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