CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

4D44AC51H01200

Manufacturer No:

1266

Manufacturer:

Laird Technologies EMI

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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4D44AC51H01200

GK,NICU,PTAFG,PU,V0,REC .394X.27

  • Type
    Parameter
    Select All
  • Mfr

    Laird Technologies EMI

  • Series

    ECOGREEN™

  • Package

    Bulk

  • Product Status

    Active

  • Type

    Fabric Over Foam

  • Shape

    -

  • Width

    -

  • Length

    12.000" (304.80mm)

  • Height

    -

  • Material

    Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)

  • Plating

    -

  • Plating - Thickness

    -

  • Attachment Method

    Adhesive

  • Operating Temperature

    -40°C ~ 70°C

  • Shelf Life Start

    Date of Manufacture

  • Shelf Life

    12 Months

  • Storage/Refrigeration Temperature

    73°F (23°C)

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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