CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

4042AB51K01200

Manufacturer No:

1266

Manufacturer:

Laird Technologies EMI

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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4042AB51K01200

GK NICU NRS PU V0 REC

  • Type
    Parameter
    Select All
  • Mfr

    Laird Technologies EMI

  • Series

    51K

  • Package

    Bulk

  • Product Status

    Active

  • Type

    Fabric Over Foam

  • Shape

    Rectangle

  • Width

    0.126" (3.20mm)

  • Length

    12.000" (304.80mm)

  • Height

    0.118" (3.00mm)

  • Material

    Polyurethane Foam, Nickel-Copper Polyester (NI/CU)

  • Plating

    -

  • Plating - Thickness

    -

  • Attachment Method

    -

  • Operating Temperature

    -

  • Shelf Life Start

    -

  • Shelf Life

    12 Months

  • Storage/Refrigeration Temperature

    73°F (23°C)

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  • Manufacturer No:

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  • Description:

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