CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

3FD-556

Manufacturer No:

926

Manufacturer:

Tamura

Quantity:

9999

Model:

default

Datasheet:

3FD-556

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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3FD-556

PWR XFMR LAMINATED 12VA TH

  • Type
    Parameter
    Select All
  • Mfr

    Tamura

  • Series

    3FD-5xx

  • Package

    Tube

  • Product Status

    Active

  • Type

    Laminated Core

  • Voltage - Primary

    115V, 230V

  • Voltage - Secondary (Full Load)

    Parallel 28V, Series 56V

  • Current - Output (Max)

    Parallel 440mA, Series 220mA

  • Primary Winding(s)

    Dual

  • Secondary Winding(s)

    Dual

  • Center Tap

    No

  • Power - Max

    12VA

  • Mounting Type

    Through Hole

  • Termination Style

    PC Pin

  • Size / Dimension

    48.50mm L x 41.52mm W

  • Height - Seated (Max)

    38.00mm

  • Voltage - Isolation

    2500Vrms

  • Weight

    -

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Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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