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Home Product, Material Handling and Storage - Storage Containers and Bins Heavy Duty Connectors - Assemblies 25CPC700BB3B66

25CPC700BB3B66

Manufacturer No:

426

Manufacturer:

IBM

Quantity:

9999

Model:

default

Datasheet:

25CPC700BB3B66

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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25CPC700BB3B66

MEMORY CONTROLLER AND PCI BRIDGE

  • Type
    Parameter
    Select All

  • Mfr

    IBM

  • Series

    IBM25PPC750FX

  • Package

    Bulk

  • Product Status

    Active

  • Controller Type

    Dynamic RAM (DRAM)

  • Voltage - Supply

    3.135V ~ 3.465V

  • Operating Temperature

    -40°C ~ 105°C (TJ)

  • Mounting Type

    Surface Mount

  • Package / Case

    474-BCBGA Exposed Pad

  • Supplier Device Package

    474-CBGA (25x32)

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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