CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

2328461-2

Manufacturer No:

30

Quantity:

9999

Model:

default

Datasheet:

2328461-2

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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2328461-2

CONN EDGE DUAL FML 280POS 0.024

  • Type
    Parameter
    Select All
  • Mfr

    TE Connectivity AMP Connectors

  • Series

    Sliver 2.0

  • Package

    Tray

  • Product Status

    Active

  • Card Type

    Non Specified - Dual Edge

  • Gender

    Female

  • Number of Positions/Bay/Row

    28; 28; 28; 28; 28

  • Number of Positions

    280

  • Card Thickness

    0.062" (1.57mm)

  • Number of Rows

    2

  • Pitch

    0.024" (0.60mm)

  • Read Out

    Dual

  • Features

    Board Guide, Pick and Place, Solder Retention

  • Mounting Type

    Surface Mount

  • Termination

    Solder

  • Contact Material

    Copper Alloy

  • Contact Finish

    Gold

  • Contact Finish Thickness

    15.0µin (0.38µm)

  • Contact Type

    -

  • Color

    Black

  • Flange Feature

    -

  • Operating Temperature

    -55°C ~ 85°C

  • Material - Insulation

    Liquid Crystal Polymer (LCP)

  • Base Product Number

    2328461

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