CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

2301

Manufacturer No:

484

Manufacturer:

Microsemi Corporation

Quantity:

9999

Model:

default

Datasheet:

2301

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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2301

RF TRANS NPN 45V 2.3GHZ 55BT

  • Type
    Parameter
    Select All
  • Mfr

    Microsemi Corporation

  • Series

    -

  • Package

    Bulk

  • Product Status

    Obsolete

  • Transistor Type

    NPN

  • Voltage - Collector Emitter Breakdown (Max)

    45V

  • Frequency - Transition

    2.3GHz

  • Noise Figure (dB Typ @ f)

    -

  • Gain

    8dB

  • Power - Max

    5.6W

  • DC Current Gain (hFE) (Min) @ Ic, Vce

    10 @ 100mA, 5V

  • Current - Collector (Ic) (Max)

    300mA

  • Operating Temperature

    200°C (TJ)

  • Mounting Type

    Chassis Mount

  • Package / Case

    55BT

  • Supplier Device Package

    55BT

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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