CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

130B20D31200KE

Manufacturer No:

308

Manufacturer:

METZ CONNECT USA Inc.

Quantity:

9999

Model:

default

Datasheet:

130B20D31200KE

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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130B20D31200KE

WALL OUTLET, KEYSTONE, UP0, 3 PO

  • Type
    Parameter
    Select All
  • Mfr

    METZ CONNECT USA Inc.

  • Series

    -

  • Package

    Bulk

  • Product Status

    Active

  • Style

    Single Gang

  • Type

    Faceplate Frame

  • Number of Ports

    3

  • Port Direction

    Angled/Sloped

  • Color

    -

  • Features

    Mounting Hardware

  • For Use With/Related Products

    -

  • Length

    0.606" (15.39mm)

  • Width

    2.752" (69.90mm)

  • Depth

    2.752" (69.90mm)

  • Material

    Zinc Alloy

  • Material Flammability Rating

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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