CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

11100304

Manufacturer No:

4074

Manufacturer:

Embassy Industries

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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11100304

EMBASSY LIQUIPEX 3/8" NOMINAL I.

  • Type
    Parameter
    Select All
  • Mfr

    Embassy Industries

  • Series

    -

  • Package

    Box

  • Product Status

    Active

  • Material

    Polyethylene

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Microchip Technology PIC18F24J11T-I/SS

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