CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Weight Package Frequency Series Datasheet Mfr Features Height Ratings Finish Operating Temperature Voltage Rating - AC Mounting Type Voltage Rating - DC Voltage - Supply Size / Dimension Package / Case Filter Type Approval Agency Sensor Type Accuracy Output Number of Channels Height - Seated (Max) Response Time Product Status Inductance Sensitivity Current - Supply (Max) Polarization Height (Max) Diameter Turns Ratio - Primary:Secondary Transformer Type Number of Lines Impedance @ Frequency Current Rating (Max) DC Resistance (DCR) (Max) ET (Volt-Time) For Measuring Inductance @ Frequency Linearity Current - Sensing Core Type Gap Effective Area (Ae) mm² Effective Length (le) mm Inductance Factor (Al)
T60004L2025W622 T60004L2025W622 VACUUMSCHMELZE 4.5500
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 0.484" (12.30mm) Epoxy Active 1.075" (27.30mm) Toroid Ungapped 19 71 22.5 µH
T60006L2025W451 T60006L2025W451 VACUUMSCHMELZE 5.2100
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 0.492" (12.50mm) Uncoated Active 1.098" (27.90mm) Toroid Ungapped 36 64.4 17.55 µH
T60006L2080V140 T60006L2080V140 VACUUMSCHMELZE 78.4200
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 1.004" (25.50mm) Uncoated Active 3.378" (85.80mm) Toroid Ungapped 228 204 94 µH
T60403F5046X008 T60403F5046X008 VACUUMSCHMELZE 11.3200
RFQ

Min: 1

Mult: 1

0.00000000 - Tape & Reel (TR) - download VACUUMSCHMELZE -40°C ~ 85°C Through Hole 0.791" L x 0.591" W (20.10mm x 15.00mm) 0.413" (10.50mm) Active 2.32mH 1:1:1:1 Gate Drive 110VµS
T60404N4644X053 T60404N4644X053 VACUUMSCHMELZE 95.8900
RFQ

Min: 1

Mult: 1

0.00000000 Box DC ~ 50kHz - download VACUUMSCHMELZE -40°C ~ 70°C (TA) Chassis Mount 14.75V ~ 15.25V Module, Single Pass Through - ±0.5% Ratiometric, Current 1 3µs Active - 35mA Unidirectional - ±0.1% 500A
T60404N4647X460 T60404N4647X460 VACUUMSCHMELZE 13.7300
RFQ

Min: 1

Mult: 1

0.00000000 Box DC ~ 100kHz - download VACUUMSCHMELZE -40°C ~ 85°C (TA) Through Hole 4.75V ~ 5.25V 10-DIP Module Closed Loop ±0.7% Ratiometric, Voltage 1 1µs Active - 16mA Unidirectional AC/DC ±0.1% 50A
T60405R6123X248 T60405R6123X248 VACUUMSCHMELZE 21.9700
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE - - -40°C ~ 130°C - Through Hole - 2.008" Dia (51.00mm) Horizontal, 4 PC Pin - - Active 1.311" (33.30mm) 2 660 Ohms @ 100 kHz 46A - 580 µH @ 100 kHz
T60405S6123X402 T60405S6123X402 VACUUMSCHMELZE 38.6600
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE - - -40°C ~ 130°C - Through Hole - 2.323" Dia (59.00mm) Horizontal, 8 PC Pin - - Active 1.331" (33.80mm) 4 750 Ohms @ 100 kHz 30A - 720 µH @ 100 kHz
T60004L2030W676 T60004L2030W676 VACUUMSCHMELZE 8.3100
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 0.689" (17.50mm) Epoxy Active 1.272" (32.30mm) Toroid Ungapped 27 86.4 26.5 µH
T60006L2025W523 T60006L2025W523 VACUUMSCHMELZE 3.5400
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 0.504" (12.80mm) Uncoated Active 1.087" (27.60mm) Toroid Ungapped 20 70.7 28.4 µH
T60006L2080W531 T60006L2080W531 VACUUMSCHMELZE 70.4900
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE 1.012" (25.70mm) Uncoated Active 3.386" (86.00mm) Toroid Ungapped 228 204 35 µH
T60403F5046X100 T60403F5046X100 VACUUMSCHMELZE 6.6200
RFQ

Min: 1

Mult: 1

0.00000000 - Tape & Reel (TR) - download VACUUMSCHMELZE -40°C ~ 85°C Through Hole 0.791" L x 0.630" W (20.10mm x 16.00mm) 0.472" (12.00mm) Active 1.4mH 1:1.2:1.2 Gate Drive 80VµS
T60404N4644X054 T60404N4644X054 VACUUMSCHMELZE 98.5100
RFQ

Min: 1

Mult: 1

0.00000000 Box DC ~ 50kHz - download VACUUMSCHMELZE -40°C ~ 70°C (TA) Chassis Mount 14.75V ~ 15.25V Module, Single Pass Through - ±0.5% Ratiometric, Current 1 1µs Active - 45mA Unidirectional - ±0.1% 700A
T60404N4647X461 T60404N4647X461 VACUUMSCHMELZE 13.8800
RFQ

Min: 1

Mult: 1

0.00000000 Box DC ~ 100kHz - download VACUUMSCHMELZE -40°C ~ 85°C (TA) Through Hole 4.75V ~ 5.25V 10-DIP Module Closed Loop ±0.7% Ratiometric, Voltage 1 1µs Active - 16mA Unidirectional AC/DC ±0.1% 100A
T60405R6123X263 T60405R6123X263 VACUUMSCHMELZE 25.6500
RFQ

Min: 1

Mult: 1

0.00000000 Box - download VACUUMSCHMELZE - - -40°C ~ 130°C - Through Hole - 2.008" Dia (51.00mm) Horizontal, 8 PC Pin - - Active 1.272" (32.30mm) 2 390 Ohms @ 100 kHz 63A - 370 µH @ 100 kHz

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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