Chip Quik Inc.(4895)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Material | Weight | Package | Type | Series | Datasheet | Mfr | Accessory Type | For Use With/Related Products | Base Product Number | Shelf Life Start | Shelf Life | Storage/Refrigeration Temperature | Wire Gauge | Size / Dimension | Number of Positions | Pitch | Board Thickness | Form | Product Status | Proto Board Type | Plating | Circuit Pattern | Edge Contacts | Hole Diameter | Package Accepted | Digi-Key Storage | Note | Composition | Diameter | Shipping Info | Melting Point | Flux Type | Process |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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PA0228 | Chip Quik Inc. | 7.3900 |
Min: 1 Mult: 1 |
0.00000000 | FR4 Epoxy Glass | Bulk | Proto-Advantage | download | Chip Quik Inc. | 1.000" x 1.600" (25.40mm x 40.64mm) | 32 | 0.020" (0.50mm) | 0.062" (1.57mm) 1/16" | Active | SMD to DIP | TSOP | ||||||||||||||||||||||||
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PA0240C | Chip Quik Inc. | 16.6900 |
Min: 1 Mult: 1 |
0.00000000 | - | Bulk | Proto-Advantage | download | Chip Quik Inc. | 2.400" L x 0.700" W (60.96mm x 17.78mm) | 48 | 0.026" (0.65mm) | - | Active | SMD to DIP | LQFP | ||||||||||||||||||||||||
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RASW.015 100G | Chip Quik Inc. | 15.5100 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Wire Solder | - | download | Chip Quik Inc. | RASW.015 | - | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Active | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Activated (RA) | Leaded | |||||||||||||||||||||
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RASWLF.015 2OZ | Chip Quik Inc. | 12.9000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Wire Solder | - | download | Chip Quik Inc. | RASW | - | 27 AWG, 28 SWG | Spool, 2 oz (56.70g) | Active | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | Lead Free | |||||||||||||||||||||
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REM16-NL | Chip Quik Inc. | 70.4900 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | CHIPQUIK® | download | Chip Quik Inc. | Removal Alloy | SMD Components | - | - | - | Active | ||||||||||||||||||||||||||
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RMA591 | Chip Quik Inc. | 24.9900 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Flux - Rosin Mildly Activated (RMA) | CHIPQUIK® | download | Chip Quik Inc. | Date of Manufacture | 24 Months | 37°F ~ 77°F (3°C ~ 25°C) | Syringe, 0.35 oz (10g), 10cc | Active | ||||||||||||||||||||||||||
| SBB2802P-1 | Chip Quik Inc. | 4.7800 |
Min: 1 Mult: 1 |
0.00000000 | FR4 Epoxy Glass | Bulk | Proto-Advantage | Chip Quik Inc. | 3.00" L x 1.00" W (76.2mm x 25.4mm) | 0.1" (2.54mm) Grid | 0.063" (1.60mm) | Active | Breadboard, General Purpose | Plated Through Hole (PTH) | Pad Per Hole (Round) | - | 0.039" (1.00mm) | ||||||||||||||||||||||||
| SBBSM3030-1 | Chip Quik Inc. | 9.4900 |
Min: 1 Mult: 1 |
0.00000000 | FR4 Epoxy Glass | Bulk | Proto-Advantage | Chip Quik Inc. | SBBSM | 3.20" L x 3.10" W (81.3mm x 78.7mm) | 0.1" (2.54mm) Grid | 0.063" (1.60mm) | Active | Breadboard, Surface Mount | Plated Surface Mount | Pads (Square) | - | - | |||||||||||||||||||||||
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SBBTH3030-1 | Chip Quik Inc. | 8.3900 |
Min: 1 Mult: 1 |
0.00000000 | FR4 Epoxy Glass | Bulk | Proto-Advantage | Chip Quik Inc. | SBBTH | 3.20" L x 3.10" W (81.3mm x 78.7mm) | 0.100" (2.54mm) | 0.063" (1.60mm) | Active | Breadboard, General Purpose | Plated Through Hole (PTH) | Pad Per Hole (Round) | - | 0.039" (1.00mm) | ||||||||||||||||||||||
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SGF991-10CC | Chip Quik Inc. | 16.3100 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Flux - Lead Free, Water-Soluble | CHIPQUIK® | download | Chip Quik Inc. | Date of Manufacture | 24 Months | 37°F ~ 77°F (3°C ~ 25°C) | Syringe, 0.35 oz (10g), 10cc | Active | - | |||||||||||||||||||||||||
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SMD2000 | Chip Quik Inc. | 115.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | - | download | Chip Quik Inc. | Solder Removal Kit | - | Date of Manufacture | 12 Months, 6 Months | 37°F ~ 46°F (3°C ~ 8°C) | Active | Refrigerated | |||||||||||||||||||||||||
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SMD2050-25000 | Chip Quik Inc. | 22.3900 |
Min: 1 Mult: 1 |
0.00000000 | Jar | Solder Sphere | SMD2 | download | Chip Quik Inc. | Date of Manufacture | 24 Months | - | - | Jar | Active | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024" (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | Lead Free | |||||||||||||||||||
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SMD2185-25000 | Chip Quik Inc. | 17.9900 |
Min: 1 Mult: 1 |
0.00000000 | - | Bulk | Solder Sphere | SMD2 | download | Chip Quik Inc. | Date of Manufacture | 24 Months | - | - | Jar | Active | Sn63Pb37 (63/37) | 0.018" (0.46mm) | - | 361°F (183°C) | - | Leaded | ||||||||||||||||||
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SMD29175G | Chip Quik Inc. | 63.9500 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Flux - No Clean, Tacky Solder | CHIPQUIK® | download | Chip Quik Inc. | Date of Manufacture | 24 Months | 37°F ~ 77°F (3°C ~ 25°C) | Jar, 2.65 oz (75g) | Active | - | - | ||||||||||||||||||||||||
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SMD291NL | Chip Quik Inc. | 11.9500 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Flux - No Clean, Lead Free | CHIPQUIK® | download | Chip Quik Inc. | Date of Manufacture | 24 Months | 37°F ~ 77°F (3°C ~ 25°C) | Syringe, 0.18 oz (5g), 5cc | Active | - | - |
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