Manufacturer
Packaging
Product Status
Series
Board Material
Contact Finish - Mating
Contact Finish - Post
Convert From (Adapter End)
Convert To (Adapter End)
Housing Material
Mounting Type
Number of Pins
Pitch - Mating
Pitch - Post
Termination
Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Package | Series | Datasheet | Mfr | Features | Base Product Number | Current Rating (Amps) | Operating Temperature | Mounting Type | Termination | Material Flammability Rating | Housing Material | Convert From (Adapter End) | Convert To (Adapter End) | Product Status | Number of Pins | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Termination Post Length | Board Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1107254-28 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1107254 | download | Aries Electronics | - | 1107254 | 3 A | - | Through Hole | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | Active | 28 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | 0.130" (3.30mm) | - | ||
1107254-24 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1107254 | download | Aries Electronics | - | 1107254 | 3 A | - | Through Hole | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | Active | 24 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | 0.130" (3.30mm) | - | ||
1106396-28 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1106396 | download | Aries Electronics | - | 1106396 | 3 A | - | Through Hole | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 28 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | 0.130" (3.30mm) | - | ||
1106396-24 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1106396 | download | Aries Electronics | - | 1106396 | 3 A | - | Through Hole | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 24 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | 0.130" (3.30mm) | - | ||
222-3343-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | - | 222 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | Active | 22 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
228-1277-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | - | 228 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 28 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
240-1280-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | - | 240 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 40 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
28-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 354000 | Aries Electronics | - | 28-3540 | 3 A | 105°C | Surface Mount | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | SOIC | Active | 28 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | - | - | |||
20-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 354000 | Aries Electronics | - | 20-3540 | 3 A | 105°C | Surface Mount | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | SOIC | Active | 20 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | - | - | |||
1110087 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1110087 | Aries Electronics | - | 1110087 | 105°C | Through Hole | Solder | - | - | VQFP | PGA | Active | 144 | 0.020" (0.50mm) | Gold | - | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||
44-653000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 653000 | download | Aries Electronics | Socket Included | 44-6530 | 1 A | - | Through Hole | Solder | UL94 V-0 | - | PLCC | DIP, 0.6" (15.24mm) Row Spacing | Active | 44 | 0.050" (1.27mm) | - | - | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
1109523 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 1109523 | download | Aries Electronics | Socket Included | 1109523 | 1 A | - | Through Hole | Solder | UL94 V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | JEDEC | Active | 8 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
20-350001-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 350000 | download | Aries Electronics | - | 20-3500 | - | Through Hole | Solder | - | - | SOJ | DIP, 0.3" (7.62mm) Row Spacing | Active | 20 | 0.050" (1.27mm) | - | - | - | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
32-450001-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 450001 | download | Aries Electronics | - | 32-4500 | - | Through Hole | Solder | - | - | SOJ | DIP, 0.4" (10.16mm) Row Spacing | Active | 32 | 0.050" (1.27mm) | - | - | - | 0.100" (2.54mm) | - | - | - | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
224-1275-19-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 224 | 1 A | -55°C ~ 125°C | Through Hole | Wire Wrap | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 24 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.620" (15.75mm) | - |
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