Manufacturer
Packaging
Product Status
Series
Board Material
Contact Finish - Mating
Contact Finish - Post
Convert From (Adapter End)
Convert To (Adapter End)
Housing Material
Mounting Type
Number of Pins
Pitch - Mating
Pitch - Post
Termination
Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Package | Series | Datasheet | Mfr | Features | Base Product Number | Current Rating (Amps) | Operating Temperature | Mounting Type | Termination | Material Flammability Rating | Housing Material | Convert From (Adapter End) | Convert To (Adapter End) | Product Status | Number of Pins | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Termination Post Length | Board Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
228-1290-29-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | - | 228 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | Active | 28 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
228-4817-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | - | 228 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | Active | 28 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
232-1285-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 232 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Obsolete | 32 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
232-1285-39-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 232 | 1 A | -55°C ~ 125°C | Through Hole | Wire Wrap | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 32 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.620" (15.75mm) | - | ||
240-1280-39-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 240 | 1 A | -55°C ~ 125°C | Through Hole | Wire Wrap | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 40 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.620" (15.75mm) | - | ||
240-3639-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 240 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 1.0" (25.40mm) Row Spacing | DIP, 1.0" (25.40mm) Row Spacing | Active | 40 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
242-1281-29-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Box | Textool™ | download | 3M | Closed Frame | 242 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 42 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
20-555000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 555000 | Aries Electronics | - | 20-5550 | 105°C | Surface Mount | Solder | - | - | SSOP | SOWIC | Active | 20 | 0.026" (0.65mm) | - | - | - | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | - | FR4 Epoxy Glass | ||||
218-3341-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | - | 218 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | Active | 18 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
220-3342-09-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | Closed Frame | 220 | 1 A | -55°C ~ 125°C | Through Hole | Solder | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | Active | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.130" (3.30mm) | - | ||
32-653000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 653000 | download | Aries Electronics | Socket Included | 32-6530 | 1 A | - | Through Hole | Solder | UL94 V-0 | - | PLCC | DIP, 0.6" (15.24mm) Row Spacing | Active | 32 | 0.050" (1.27mm) | - | - | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
240-1280-19-0602J | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tube | Textool™ | download | 3M | Closed Frame | 240 | 1 A | -55°C ~ 125°C | Through Hole | Wire Wrap | UL94 V-0 | Polysulfone (PSU), Glass Filled | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | Active | 40 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.620" (15.75mm) | - | ||
96-100M65 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | - | download | Aries Electronics | - | - | Through Hole | Solder | - | - | QFP | PGA | Obsolete | 100 | 0.026" (0.65mm) | Tin | - | Copper | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
96-160M65 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 96-160M65 | download | Aries Electronics | - | 96-160M | - | Through Hole | Solder | - | - | QFP | PGA | Active | 160 | 0.026" (0.65mm) | Tin | - | Copper | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
28-652000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | Correct-A-Chip® 652000 | download | Aries Electronics | - | 28-6520 | 1 A | - | Through Hole | Solder | - | - | PLCC | DIP, 0.6" (15.24mm) Row Spacing | Active | 28 | 0.050" (1.27mm) | - | - | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass |
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