CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Housing Material Convert From (Adapter End) Convert To (Adapter End) Product Status Number of Pins Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Board Material
16-354W00-10 16-354W00-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube Correct-A-Chip® 354W00 download Aries Electronics - 16-354W 3 A 105°C Through Hole Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOWIC Active 16 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass -
16-304235-10 16-304235-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Correct-A-Chip® 304235 Aries Electronics Socket Included 16-3042 1 A 105°C Through Hole Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Active 16 - Gold 10.0µin (0.25µm) Beryllium Copper - Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-351000-11-RC 18-351000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube Correct-A-Chip® 351000 download Aries Electronics - 18-3510 - Through Hole Solder - - SSOP DIP, 0.3" (7.62mm) Row Spacing Active 18 0.026" (0.65mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-650000-11-RC 24-650000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube Correct-A-Chip® 650000 download Aries Electronics - 24-650 - Through Hole Solder - - SOIC DIP, 0.6" (15.24mm) Row Spacing Active 24 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-350002-11-RC 28-350002-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube Correct-A-Chip® 350000 download Aries Electronics - 28-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Active 28 0.050" (1.27mm) - - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
242-1281-39-0602J 242-1281-39-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Obsolete 42 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
242-1293-29-0602J 242-1293-29-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 242 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Active 42 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
248-1282-09-0602J 248-1282-09-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 248 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Obsolete 48 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
248-1282-19-0602J 248-1282-19-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 248 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Active 48 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
248-1282-39-0602J 248-1282-39-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 248 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Active 48 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
264-1300-29-0602J 264-1300-29-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 264 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.8" (20.32mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing Active 64 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
290-1294-09-0602J 290-1294-09-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 290 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing Active 90 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
222-3343-19-0602J 222-3343-19-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 222 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Active 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
224-1275-39-0602J 224-1275-39-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube Textool™ download 3M - 224 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Active 24 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper -
240-1280-29-0602J 240-1280-29-0602J 3M
RFQ

Min: 1

Mult: 1

0 0x0x0 Box Textool™ download 3M Closed Frame 240 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Active 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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