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Blade Type Power Connectors(274)

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Housing Material Convert From (Adapter End) Convert To (Adapter End) Product Status Number of Pins Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Board Material
16-307349-11-RC-P (170 UP) 16-307349-11-RC-P (170 UP) Aries Electronics
RFQ

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 0.00000000 Bulk Correct-A-Chip® 307349 download Aries Electronics - 16-3073 - Through Hole Solder - - PLCC DIP, 0.3" (7.62mm) Row Spacing Discontinued at Digi-Key 16 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-650000-10-P 32-650000-10-P Aries Electronics
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Min: 1

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 0.00000000 Tube Correct-A-Chip® 650000 download Aries Electronics - 32-6500 - Through Hole Solder - - SOIC DIP, 0.6" (15.24mm) Row Spacing Discontinued at Digi-Key 32 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead - Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP) 16-35W000-11-RC-P (220 UP) Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 16-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Discontinued at Digi-Key 16 0.050" (1.27mm) - - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-350002-11-RC-P 28-350002-11-RC-P Aries Electronics
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Min: 1

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 0.00000000 Bulk Correct-A-Chip® 350000 download Aries Electronics - 28-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Discontinued at Digi-Key 28 0.050" (1.27mm) - - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
7131-108-18 7131-108-18 Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk - download Aries Electronics - 7131-10 - Through Hole Solder - - HB2E Relay DIP, 0.3" (7.62mm) Row Spacing Active 8 - - - - - Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-650000-11-RC-P 28-650000-11-RC-P Aries Electronics
RFQ

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 0.00000000 Bulk Correct-A-Chip® 650000 download Aries Electronics - 28-650 - Through Hole Solder - - SOIC DIP, 0.6" (15.24mm) Row Spacing Discontinued at Digi-Key 28 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-650000-11-RC-P 24-650000-11-RC-P Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 650000 download Aries Electronics - 24-650 - Through Hole Solder - - SOIC DIP, 0.6" (15.24mm) Row Spacing Discontinued at Digi-Key 24 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-307349-11-RC 16-307349-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 307349 download Aries Electronics - 16-3073 - Through Hole Solder - - PLCC DIP, 0.3" (7.62mm) Row Spacing Active 16 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-450001-11-RC 28-450001-11-RC Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk Correct-A-Chip® 450001 download Aries Electronics - 28-4500 - Through Hole Solder - - SOJ DIP, 0.4" (10.16mm) Row Spacing Active 28 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-354000-21-RC 18-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 18-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 18 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
18-354000-11-RC 18-354000-11-RC Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 18-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 18 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
08-354000-11-RC 08-354000-11-RC Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 08-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 8 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
08-354000-21-RC 08-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 08-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 8 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
28-354000-21-RC 28-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 28-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 28 - Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
28-354000-11-RC 28-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 28-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 28 - Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
24-354000-21-RC 24-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 24-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 24 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
20-354000-21-RC 20-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 20-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 20 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
24-354000-11-RC 24-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 24-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 24 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
20-354000-11-RC 20-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 20-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 20 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
16-354000-11-RC 16-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 16-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 16 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
16-354000-21-RC 16-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 16-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 16 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
14-354000-21-RC 14-354000-21-RC Aries Electronics
RFQ

Min: 1

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 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 14-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 14 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.089" (2.28mm) -
14-354000-11-RC 14-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 354000 download Aries Electronics - 14-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 14 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.030" (0.76mm) -
24-35W000-11-RC 24-35W000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 24-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Active 24 0.050" (1.27mm) - - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-35W000-11-RC 28-35W000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 28-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Active 28 - - - - 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-35W000-11-RC 18-35W000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 18-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Active 18 0.050" (1.27mm) - - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
12-350000-10-HT 12-350000-10-HT Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 350000 download Aries Electronics - 12-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Active 12 0.050" (1.27mm) Tin - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) Polyimide (PI)
10-350000-10-HT 10-350000-10-HT Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 350000 download Aries Electronics - 10-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Active 10 0.050" (1.27mm) Tin - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) Polyimide (PI)
18-350000-10-HT 18-350000-10-HT Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 350000 download Aries Electronics - 18-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Active 18 0.050" (1.27mm) Tin - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) Polyimide (PI)
24-350000-10-HT 24-350000-10-HT Aries Electronics
RFQ

Min: 1

Mult: 1

 0.00000000 Bulk Correct-A-Chip® 350000 download Aries Electronics - 24-3500 - Through Hole Solder - - SOIC DIP, 0.3" (7.62mm) Row Spacing Active 24 0.050" (1.27mm) Tin - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) Polyimide (PI)

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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