CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Material Package Series Datasheet Mfr Base Product Number Size / Dimension Number of Positions Pitch Board Thickness Product Status Proto Board Type Package Accepted
33623 33623 Capital Advanced Technologies
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bag 33000, Surfboards® download Capital Advanced Technologies 0.600" L x 0.500" W (15.24mm x 12.70mm) 3 0.100" (2.54mm) 0.031" (0.79mm) 1/32" Active SMD to SIP SOT-223, SC-63
18-350000-10 18-350000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bulk Correct-A-Chip® 350000 download Aries Electronics 18-3500 1.800" L x 0.450" W (45.72mm x 11.43mm) 18 0.050" (1.27mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SOIC
8100-SMT4 8100-SMT4 Twin Industries
RFQ

Min: 1

Mult: 1

0 0x0x0 - Bulk - Twin Industries 6.000" L x 4.000" W (152.40mm x 101.60mm) - 0.020" (0.50mm) 0.062" (1.57mm) 1/16" Obsolete SMD to Plated Through Hole Board SOIC
8100-SMT7 8100-SMT7 Twin Industries
RFQ

Min: 1

Mult: 1

0 0x0x0 - Bulk - Twin Industries 8100 4.200" L x 4.200" W (106.68mm x 106.68mm) - - 0.062" (1.57mm) 1/16" Active SMD to Plated Through Hole Board SOIC
8100-SMT9 8100-SMT9 Twin Industries
RFQ

Min: 1

Mult: 1

0 0x0x0 - Bulk - Twin Industries 8100 7.900" L x 3.100" W (200.66mm x 78.74mm) - - 0.062" (1.57mm) 1/16" Active SMD to DIP PSOP, SSOP, TSOP
PA-SOD3SM18-08 PA-SOD3SM18-08 Logical Systems Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 - Box - download Logical Systems Inc. PA-SOD 0.450" L x 0.500" W (11.43mm x 12.70mm) 8 0.050" (1.27mm) 0.031" (0.79mm) 1/32" Active SMD to DIP SOIC
PA-SSD3SM18-08 PA-SSD3SM18-08 Logical Systems Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 - Box - download Logical Systems Inc. PA-SSD3 0.450" L x 0.450" W (11.43mm x 11.43mm) 8 0.026" (0.65mm) - Active SMD to DIP SSOP, TSSOP
20-351000-11-RC 20-351000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 - Tube Correct-A-Chip® 351000 download Aries Electronics 20-3510 2.000" L x 0.400" W (50.80mm x 10.16mm) 20 0.026" (0.65mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SSOP
24-350000-11-RC 24-350000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Tube Correct-A-Chip® 350000 download Aries Electronics 24-3500 2.400" L x 0.450" W (60.96mm x 11.43mm) 24 0.050" (1.27mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SOIC
28-650000-11-RC 28-650000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Tube Correct-A-Chip® 650000 download Aries Electronics 28-650 2.800" L x 0.700" W (71.12mm x 17.78mm) 28 0.050" (1.27mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SOIC
32-650000-10 32-650000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bulk Correct-A-Chip® 650000 download Aries Electronics 32-6500 3.200" L x 0.480" W (81.28mm x 12.19mm) 32 0.050" (1.27mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SOJ
24-350000-10 24-350000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bulk Correct-A-Chip® 350000 download Aries Electronics 24-3500 2.400" L x 0.450" W (60.96mm x 11.43mm) 24 0.050" (1.27mm) 0.062" (1.57mm) 1/16" Active SMD to DIP SOIC
US-1010 US-1010 Capital Advanced Technologies
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bag 1000, UNI-SIP™ download Capital Advanced Technologies 0.500" L x 1.000" W (12.70mm x 25.40mm) 10 - 0.031" (0.79mm) 1/32" Active Through Hole to SIP Non Specific
US-2008 US-2008 Capital Advanced Technologies
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bag 2000, UNI-SIP™ download Capital Advanced Technologies 0.598" L x 0.800" W (15.20mm x 20.30mm) 8 - 0.031" (0.79mm) 1/32" Active Through Hole to SIP Non Specific
US-2007 US-2007 Capital Advanced Technologies
RFQ

Min: 1

Mult: 1

0 0x0x0 FR4 Epoxy Glass Bag 2000, UNI-SIP™ download Capital Advanced Technologies 0.598" L x 0.701" W (15.20mm x 17.80mm) 7 - 0.031" (0.79mm) 1/32" Active Through Hole to SIP Non Specific

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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